The main Competence of the team includes

• Product design and multidisciplinary activities viz. circuit building, prototyping, PCB assembly, coding, board bring-up, troubleshooting, production, system integration, and documentation.

• Designing embedded products using 8-bit, 16-bit, and 32-bit Microcontrollers, TI’s 32-bit Digital Signal Processors, Xilinx’s Field Programmable Gate Arrays, and Zynq System on Chips, Silicon Labs -EFR XXXX, etc.

• Interfacing DDR3, USB, 10/100 Ethernet, QVGA displays, RS485, I2C, PI, UART, in embedded boards.

• Designing sensor interface and analog signal conditioning circuits using OpAmps, comparators, voltage references, and interfaced ADCs & DACs.

• Designing complex PCBs for Analog, Mixed Signal, High-Speed Digital, and RF circuits using OrCad and Cadence Allegro tools.

• Designing Power Distribution Network in PCBs to meet the requirements of power sequencing, noise decoupling, efficient battery usage, and crosstalk suppression.

• Collaborating with the mechanical team for enclosure design by exchanging and using CAD data.

• Expertise in using measurement equipment such as DSOs, Logic Analyser, Network Analyser, Function Generators, Multimeters for board bring-up.

• Setting up a pilot production facility for SMT assembly of PCBs, consisting of ESD protected lab, Stencil Printer, Pick and Place Machines, Reflow Oven, Optical Microscope, and Rework Station.

• Software development in Matlab, Embedded OS, Visual C++, Linux OS

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PCB design expertise

• Multilayer PCBs up to 16 layers.

• HDI PCBs using blind and buried vias.

• Flex and Rigid-Flex PCBs.

• Analog and Mixed-signal designs.

• High-speed Digital PCBs.

• SMPS and modular power supplies.

• Backplane PCBs.

• Motherboard and Daughter Card PCBs.

• Audio Amplifiers and RF Power amplifiers.

• Analogue filters and Harmonic filter PCBs.

• RF front End LNA PCBs.

• A/D and D/A converter PCBs.

• HMI PCBs.

• RF Transceivers.

• Multigigabit Ethernet Switch.

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Designs include devices such as

• FPGAs such as Spartan Virtex, Artix and Zynq,

• Multicore DSP+ARM KeyStone II System-on-Chip

• TI OMAP 3530, L138, Sitara processor: dual Arm Cortex-A15 & dual DSP, TIVA 

• DDR, LPDDR 

• GPS/GLONASS

• ADC,DACs                                                                                                              

Designs include interfaces such as

• Multi-Gigabit Ethernet Transceivers.

• PCIe

• USB2.0, USB2.0, USB-C

• DDR2, DDR3

• I2C, UART, RS232, RS485

• GPMC, EMIF, MCBSP, MCASP, SPI